HP reported $4.94B in Loan Capital for its fourth fiscal quarter of 2020.

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Loan Capital Change
Accenture ACN:US $ 59.32M 0M
Advanced Micro Devices AMD:US $ 313M 17M
Amphenol APH:US $ 4110.3M 474.1M
Apple AAPL:US $ 108642M 9361M
Applied Materials AMAT:US $ 5449M 1M
Arista Networks ANET:US $ 0M 0M
Avago Technologies AVGO:US $ 41094M 832M
Canon 7751:JP Y 4.76B 75M
CDW CDW:US 3.91B 54.8M
Celestica USA CLS:US C$ 469.7M 16.4M
Ciena CIEN:US $ 738.25M 0.33M
Cisco Systems CSCO:US $ 9554M 10M
Commscope COMM:US $ 9486.7M 1.9M
Corning GLW:US $ 7650M 166M
F5 Networks FFIV:US $ 359.41M 4.82M
Flextronics International FLEX:US 3.52B 225M
HP HPQ:US $ 4939M 604M
IBM IBM:US $ 51206M 3149M
Intel INTC:US $ 33237M 660M
Jabil Circuit JBL:US $ 2.68B 814K
Juniper Networks JNPR:US $ 1685.2M 20.6M
Kla Tencor KLAC:US $ 3422.1M 19.37M
Lam Research LRCX:US $ 4998.01M 1.79M
Lenovo Group 992:HK K$ 4246.48M 1373.49M
Micron Technology MU:US $ 6298M 58M
Microsoft MSFT:US $ 61308M 4647M
Motorola Solutions Msi MSI:US $ 5164M 1M
NCR NCR:US $ 3374M 81M
Netapp NTAP:US $ 2632M 1M
Nvidia NVDA:US $ 5964M 1M
Oracle ORCL:US $ 63541M 10M
Qualcomm QCOM:US $ 15235M 4M
Ricoh 7752:JP 186.41B 31.42B
Sanmina SANM:US $ 320.4M 4.42M
Seagate Technology STX:US $ 4897M 223M
Seiko Epson 6724:JP 237.78B 635M
Synnex SNX:US $ 1496.97M 0M
Te Connectivity TEL:US $ 3602M 86M
Western Digital WDC:US $ 8678M 204M
Xerox XRX:US $ 3674M 376M