HP reported $6.9B in Loan Capital for its second fiscal quarter of 2021.


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Loan Capital Change
Accenture ACN:US $ 53.47M 8.16M
Advanced Micro Devices AMD:US $ 313M 0M
Amphenol APH:US $ 4710.2M 599.9M
Apple AAPL:US $ 105752M 2890M
Applied Materials AMAT:US $ 5451M 1M
Arista Networks ANET:US $ 0M 0M
Avago Technologies AVGO:US $ 40205M 18M
Canon 7751:JP Y 5.67B 914M
CDW CDW:US 3.91B 1.9M
Celestica USA CLS:US C$ 474.1M 4.4M
Ciena CIEN:US $ 671.86M 69.77M
Cisco Systems CSCO:US $ 9018M 514M
Commscope COMM:US $ 9484.8M 1.9M
Corning GLW:US $ 7025M 625M
F5 Networks FFIV:US $ 354.59M 4.82M
Flextronics International FLEX:US 3.51B 10M
HEWLETT PACKARD HPE:US $ 12489M 193M
HP HPQ:US $ 6898M 1981M
IBM IBM:US $ 48735M 2471M
Intel INTC:US $ 31714M 1523M
Juniper Networks JNPR:US $ 1694.4M 9.2M
Kla Tencor KLAC:US $ 3422.77M 0.67M
Lam Research LRCX:US $ 4990.33M 4.5M
Lenovo Group 992:HK K$ 3621.97M 10.88M
Microsoft MSFT:US $ 50074M 11234M
Motorola Solutions Msi MSI:US $ 5686M 522M
NCR NCR:US $ 5668M 2294M
Netapp NTAP:US $ 2633M 1M
Nvidia NVDA:US $ 10943M 4979M
Oracle ORCL:US $ 75970M 25M
Qualcomm QCOM:US $ 13695M 1540M
Ricoh 7752:JP 166.18B 20.23B
Sanmina SANM:US $ 315.99M 4.42M
Seagate Technology STX:US $ 4894M 3M
Seiko Epson 6724:JP 236.86B 915M
SENSATA TECHNOLOGIES ST:US $ 4241.05M 252.05M
Te Connectivity TEL:US $ 3629M 27M
Western Digital WDC:US $ 8474M 204M
Xerox XRX:US $ 3597M 77M