HEWLETT PACKARD reported $12.3B in Loan Capital for its first fiscal quarter of 2021.


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Loan Capital Change
3d Systems DDD:US $ 4.63M 24.76M
Advanced Micro Devices AMD:US $ 313M 17M
Amazon AMZN:US $ 31868M 18008M
Amphenol APH:US $ 4110.3M 474.1M
Apple AAPL:US $ 108642M 9361M
Arista Networks ANET:US $ 0M 0M
Avago Technologies AVGO:US $ 40187M 907M
CDW CDW:US 3.91B 54.8M
Ciena CIEN:US $ 673.36M 64.9M
Cisco Systems CSCO:US $ 9532M 22M
Cognizant Technology Solutions CTSH:US $ 654M 20M
Commscope COMM:US $ 9486.7M 1.9M
Corning GLW:US $ 7650M 166M
Ericsson ERIC:US $ 30612M 1290M
Extreme Networks EXTR:US $ 322.4M 6.54M
F5 Networks FFIV:US $ 359.41M 4.82M
Flextronics International FLEX:US 3.52B 225M
Fujitsu 6702:JP Y 142.06B 2.58B
Hitachi 6501:JP 1706.33B 344.28B
HP HPQ:US $ 4917M 22M
IBM IBM:US $ 51206M 3149M
Infinera INFN:US $ 455.39M 8.01M
Intel INTC:US $ 33237M 660M
Jabil Circuit JBL:US $ 2.88B 196.78M
Juniper Networks JNPR:US $ 1685.2M 20.6M
Keysight Technologies KEYS:US $ 1790M 0M
Lenovo Group 992:HK K$ 3632.85M 613.63M
Micron Technology MU:US $ 6298M 58M
Motorola Solutions Msi MSI:US $ 5164M 1M
Netapp NTAP:US $ 2632M 0M
Nvidia NVDA:US $ 5964M 0M
Oracle ORCL:US $ 75995M 12454M
Qualcomm QCOM:US $ 15235M 4M
Seagate Technology STX:US $ 4897M 223M
SENSATA TECHNOLOGIES ST:US $ 3989M 747.32M
Synnex SNX:US $ 1496.97M 0M
Te Connectivity TEL:US $ 3602M 86M
Vmware VMW:US $ 4989M 48M
Western Digital WDC:US $ 8678M 204M
Xerox XRX:US $ 3674M 376M