HEWLETT PACKARD reported $9.14B in Loan Capital for its second fiscal quarter of 2022.

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Loan Capital Change
3d Systems DDD:US $ 448.08M 3.36M
Advanced Micro Devices AMD:US $ 2465M 990M
Amazon AMZN:US $ 58053M 10388M
Amphenol APH:US $ 4834.2M 74.6M
Apple AAPL:US $ 94700M 8623M
Arista Networks ANET:US $ 0M 0M
Avago Technologies AVGO:US $ 39218M 27M
CDW CDW:US 6.48B 33.4M
Ciena CIEN:US $ 1062.45M 0.27M
Cognizant Technology Solutions CTSH:US $ 608M 9M
Commscope COMM:US $ 9524.1M 47.8M
Corning GLW:US $ 6677M 162M
Ericsson ERIC:US $ 33449M 2187M
Extreme Networks EXTR:US $ 270.57M 8.94M
F5 Networks FFIV:US $ 0M 0M
Flextronics International FLEX:US 3.13B 119M
Fujitsu 6702:JP Y 116.02B 535M
Hitachi 6501:JP 1607.89B 51.71B
HP HPQ:US $ 10294M 1990M
IBM IBM:US $ 44328M 2217M
Infinera INFN:US $ 640.08M 39.87M
Intel INTC:US $ 32548M 240M
Jabil Circuit JBL:US $ 2.87B 494M
Juniper Networks JNPR:US $ 1625.8M 22.6M
Keysight Technologies KEYS:US $ 1792M 0M
Lenovo Group 992:HK K$ 22675.53M 19779.28M
Motorola Solutions Msi MSI:US $ 6011M 322M
Netapp NTAP:US $ 2387M 1M
Nvidia NVDA:US $ 9700M 1247M
Oracle ORCL:US $ 75480M 3370M
Qualcomm QCOM:US $ 13600M 1405M
Seagate Technology STX:US $ 5062M 552M
Te Connectivity TEL:US $ 3380M 61M
Vmware VMW:US $ 11181M 785M
Western Digital WDC:US $ 7022M 65M
Xerox XRX:US $ 2764M 57M